ALEXANDRIA, Va., March 19 -- United States Patent no. D1,066,966, issued on March 18, was assigned to Helen of Troy Ltd. (St. Michael, Barbados). "French press" was invented by Sunny Kim (Port Washin... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,182, issued on March 18, was assigned to Cilag GmbH International (Zug, Switzerland). "Surgical tool positioning based on sensed parameter... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. D1,067,514, issued on March 18. "Handle for hot air comb" was invented by Ruirong Chen (Ningde, China). The patent was filed on May 9, 2024, und... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,390, issued on March 18, was assigned to Shure Acquisition Holdings Inc. (Niles, Ill.). "Microphone antenna for wireless microphone applic... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,254,416, issued on March 18, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "Compiler for implementing neural netw... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,390, issued on March 18, was assigned to Marmon Foodservice Technologies Inc. (Osseo, Minn.). "Beverage dispensing machine with cup dispen... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,175, issued on March 18, was assigned to Honda Motor Co. Ltd. (Tokyo). "Vehicle body" was invented by Kodai Baiju (Saitama, Japan) and Eii... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. D1,067,085, issued on March 18, was assigned to Fieldpiece Instruments Inc. (Orange, Calif.). "4 port heating, ventilation and air conditioning m... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,917, issued on March 18, was assigned to Leer Group (Elkhart, Ind.). "Vehicle door latch security tether" was invented by Eugene A. Dylews... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,163, issued on March 18, was assigned to Micron Technology Inc. (Boise, Idaho). "Bond pads for semiconductor die assemblies and associated... Read More